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Standard IEC standard · IEC 60249-2-13:1987

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Status: Withdrawn

· Replaced by: IEC 61249-2-4:2001 , IEC 61249-2-7:2002 , IEC 61249-2-18:2002 , IEC 61249-2-19:2001 , IEC 61249-2-21:2003 , IEC 61249-2-5:2003 , IEC 61249-2-6:2003 , IEC 61249-2-11:2003 , IEC 61249-2-2:2005 , IEC 61249-2-1:2005 , IEC 61249-2-22:2005 , IEC 61249-2-23:2005 , IEC 61249-2-26:2005 , IEC 61249-2-8:2003 , IEC 61249-2-9:2003 , IEC 61249-2-10:2003 , IEC 61249-2-12:1999 , IEC 61249-2-13:1999 Amended by: IEC 60249-2-13:1987/AMD1:1993
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Standard IEC standard · IEC 60249-2-13:1987

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
Price: 880 SEK
standard ikon

Paper

Scope
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier. The material consists of an insulating flexible film base with co

Subjects

Printed circuits and boards (31.180)